In a recent blog post, Robert Smith discusses heat sink optimization through the use of pin fins.
“Local heat transfer coefficients are highest when the air first begins to form a boundary layer. The benefit to lots of pins is that you force the boundary layers to break away often and re-create on the next pin,” Smith said.
The heat sink forms a 3D mesh of pins that cross each other and force mixing of flow. Smith plans to test it against a sample commercial heat sink for chip cooling with very high fin density.
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