Avionics Thermal Management of Airborne Electronic Equipment, 50 Years Later

BACKGROUND In a proposal submitted to the Air Force in November of 1968, Collins Radio Company described ways to improve the electronic industry’s understanding of thermal management and predictive techniques [1]. This article briefly describes that proposal and discusses what […]

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Enhanced Power Cycling Thermoelectric Modules Provide 1 Million Temperature Cycles

Global technology leader Laird has improved its advanced PC Series Power Cycling thermoelectric module (TEM) for applications that require high reliability and high volume thermal cycling between multiple temperature set points. The enhanced PC Series is now proven to perform […]

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Custom Liquid Cooling Systems Optimize Particle Accelerators Performance

Global technology leader Laird has developed self-contained liquid cooling systems (LCS) that deliver optimal temperature stabilization for more precise temperature control in particle accelerators like linear accelerators (LINACs) and cyclotron systems. LINACs and cyclotrons increase the kinetic energy of particles […]

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Introducing Our New Technical Editor – In the End, Entropy Always Wins… But Not Yet!

Greetings to all Electronics Cooling’s loyal readership and visitors, I have recently had the privilege of joining the Electronics Cooling team alongside the incredible Editorial Board and ITEM Media. My goal as part of the team is to help the […]

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Thermally Conductive Laminate Material for Demanding PCB Applications

Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, has added to its extensive thermally conductive laminate and prepreg range with the launch of the VT-5A2, a next generation best-in-class, high Tg […]

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Application of Metallic TIMs for Harsh Environments and Non-flat Surfaces

Co-authored by: David L. Saums and Tim Jensen DS&A LLC and Indium Corporation INTRODUCTION Electronic systems, implemented in such diverse industries as aerospace, vehicle, geothermal exploration, and mobile devices with a range of more challenging application conditions, create new challenges for component and […]

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Thermal Energy Harvesting with Next Generation Cooling for Automotive Electronics

Co-authored by: Feng Zhou, Shailesh N. Joshi, Ercan M. Dede Electronics Research Department, Toyota Research Institute of North America, 1555 Woodridge Ave., Ann Arbor, MI 48105, US INTRODUCTION In 2012, vehicle fuel-efficiency standards were announced that require all US cars […]

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