New Reversible Flow Fan Blows Air in Both Directions

SANYO DENKI CO., LTD. introduces the San Ace 136RF ø136 mm × 28 mm Reversible Flow Fan that blows air in both directions.

“Rotational speed is controlled using an external PWM signal to deliver an appropriate rotational speed, reducing noise and saving energy,” the company said.

The San Ace 136RF ø136 mm × 28 mm Reversible Flow Fan has about the same airflow and static pressure in both blowing directions. The fan can be used for a wide range of applications such as ventilating houses, beverage vending machines, food display cases, and printers.

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Heat Sink Optimization through Use of Pin Fins

In a recent blog post, Robert Smith discusses heat sink optimization through the use of pin fins.

“Local heat transfer coefficients are highest when the air first begins to form a boundary layer.  The benefit to lots of pins is that you force the boundary layers to break away often and re-create on the next pin,” Smith said.

The heat sink forms a 3D mesh of pins that cross each other and force mixing of flow. Smith plans to test it against a sample commercial heat sink for chip cooling with very high fin density.

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ITherm 2016: Fifteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

ITherm 2016: Fifteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

May 31 – June 03, 2016

Las Vegas, Nevada, USA

ITherm 2016 is the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems. ITherm 2016 will include panel discussions, keynote lectures by prominent speakers, and professional shortcourses.

More information here.

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Company CEO Asks “Is Free Cooling Really Free?” At Conference

CEO of LiquidCooling Solutions, Inc., Herb Zien, is serving on a panel until Thursday, Sept. 24, at the North America’s Emerging Green Conference in Portland, Oregon. On Wednesday Sept. 23, from 1:30 – 3:00 p.m., Zien will give a presentation that challenges the legitimacy of Free Cooling. Zien will explain inefficiencies and environmental waste associated with free cooling via evaporating water.

“Cooling data centers by evaporating water is the technology du jour used by Microsoft, Google, Facebook and others. Using a Facebook data center in Iowa as an example, Zien will explain why this approach is not sustainable and the practical benefits of liquid cooling,” according to Top Tech News.

Zien will also talk about data center design factors that designers should consider such as noise, maintenance, server reliability, floor space, energy consumption, water requirements, building height, real estate and more.

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Solution to Heat Transfer in Phase Change Materials Unveiled

Dr. Patrick Shamberger, assistant professor at Texas A&M University, has found an “analytical solution to heat transfer in PCMs (Phase Change Materials) used in thermal energy storage and has identified the relative role of thermo-physical properties of different materials,” according to

Shamberger is one of the lead researchers studying high-energy storage density PCMs, high thermal conductivity and thermal energy storages composites.

“It’s challenging to make a direct comparison between the relative cooling power of two different materials. It’s difficult to isolate the effects of materials properties and the effects of component geometry and boundary conditions. Here we defined a relatively simple problem and used it to investigate the relative role of different material parameters on the rate of heat absorption,” Shamberger said.

It is difficult to produce thermal energy storage materials with high-energy storage density, since head needs to be absorbed quickly. Therefore, “The results of Shamberger’s research will be helpful in designing the next generation of high-cooling power thermal storage materials, especially for electronics thermal management applications,” reported.

Shamberger’s article has been published in the Journal of Heat Transfer and is titled, “Cooling Capacity of Figure of Merit for Phase Change Materials.”

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Thermal Invisibility Cloak Improves Heat Distribution in Electronics

A team of researchers from the Nanyang Technological University (NTU) in Singapore has developed a thermal invisibility cloak that would improve heat distribution in electronic devices by redirecting incoming heat. The cloaks are capable of guiding heat around a hidden object, thus resulting in complete thermal invisibility.

“Based on carefully engineered metamaterials – materials with properties that can’t be found in nature – the technology could potentially help improve the thermal performance of various electronic systems by fine-tuning thermal dissipation,” according to Engineering and Technology Magazine.

The cloak is made of 24 small thermoelectric semiconductor heat pumps, which are controlled by external input voltages. The heat-pumps distribute heat around a 62-millimeter air hole in a carbon steel plate, which is only 5mm thick.

The research team recently invented an on/off switch for the cloak.

“We considered the question of whether we can control thermal cloaking electrically, not by guiding heat around the hidden object passively with traditional metamaterials, but by ‘pumping’ heat from one side of the hidden object to the other side actively, with thermoelectric modules,” Professor Baile Zhang, lead researcher in the project, noted.

“The device could help optimize the thermal performance of a large variety of electronic devices including high-power engines, magnetic resonance imaging instruments and thermal sensors. Because of its shape flexibility, the active thermal cloak might also be applied in human garments for effective cooling and warming, which makes a lot of sense in tropical areas such as Singapore,” Zhang added.

“In the experiments, the researchers attached the modules to two surfaces with temperatures of 60°C and 0°C. Subsequently, they applied a variety of specific voltages to each of the 24 modules and observed how the heat falling on the hot-surface side of the air hole was absorbed and delivered to a constant-temperature copper heat reservoir attached to the modules. The modules on the cold-surface side released the same amount of heat from the reservoir into the steel plate. This prevented heat from diffusing through the air hole,” Engineering and Technology Magazine reported.

“Additionally, the researchers found that their active thermal cloaking was not limited by the shape of the object being hidden. When applied to a rectangular air hole, the thermoelectric devices redistributed heat just as effectively as in the circular one.”

Zhang and his team plan to apply thermal cloaks in electronic systems in the near future, which could improve the efficiency of heat transfer in electronics.

The team’s work is described in an article in the latest issue of Applied Physics Letters.

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Presentation on 4H SiC Epitaxial Wafer Quality and Layer Growth

Dow Corning will present at the 16th International Conference on Silicon Carbide and Related Materials (ICSCRM) Oct. 4 through 9.

ICSCRM is a technical conference that provides information on electronics device technology based on silicon carbide (SiC) and related materials.

It brings qualified experts together to discuss crystal growth and characterization, control of material properties, and other research issues.

At the conference, the company plans to demonstrate advances in large-area 4H SiC epitaxial wafer quality and layer growth.

“New devices using wide-bandgap semiconductors like SiC are expected to have a large impact in many power electronics systems, as these devices are significantly more durable, more energy-efficient and faster-switching than devices made from other semiconductor materials,” added the company.

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