Atom Cooling Technique Discovered

A team of researchers from the University of Southampton have successfully used matter waves to cool molecules that cannot be handled by typical laser methods. This is the first demonstration of this technique, which was first proposed by Martin Weitz and Ted Hänsch in 2000. The team’s research has been published in the Physical Review Letters and is titled “Interferometric Laser Cooling of Atomic Rubidium.”

Cold atoms are frequently used in atomic clocks, physics research, and possibly in quantum computers.

“Currently, atoms are cooled from room temperature to near absolute zero by preferential scattering of laser photons from the moving particle, which slows it. This requires a favorable electronic structure and is limited to a small fraction of atomic elements and a few diatomic molecules,” the team reported.

“There is a great push to extend ultra-cold physics to the rest of the periodic table to explore a wealth of fundamental processes and develop new technologies. Our technique, should we succeed in extending it to Weitz and Hänsch’s complete scheme, would be sort of a catch-all, that’s why this is exciting, even though our actual experiment just uses atoms,” Dr. Alex Dunning, Southampton physicist, said.

During the demonstration, the team used a Rubidium that was already cold and lowered its temperature down close to the limit of laser cooling.

“The same atom is both the matter waves, as it is placed into a superposition of states by a laser pulse and travels simultaneously along two paths, which interfere at a later time. Impulse imparted to the atom depends on how the difference in energy along the two paths compares with the energy of the laser photons, where the atom’s energy is formed of potential (internal electron configuration) and kinetic (external motion) parts,” according to the university.

“The clever trick behind Weitz and Hänsch’s scheme is to make the laser interact with the atoms in such a manner as to remove the dependence on the potential energy, and thus the internal electronic structure, leaving the interference based solely on the kinetic energy of the particle,” researchers added.

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Solid-state CPU Cooler Offers Advanced Cooling

Phononic unveils a new solid-state CPU cooler, the Phononic model HEX 1.0. The small package, with dimensions of 4.3″ x 3.5″ x 3.5″, offers an advanced cooling performance despite its tiny size.

“Unlike traditional heatsink/fan CPU coolers that continue to grow in size, the HEX 1.0 is built to meet today’s high-performance computing needs in a much smaller form factor, which allows consumers to utilize enclosures ranging from mini-ITX to full size EATX towers,” according to the company.

The CPU cooler comes with a control board with Variable Assist Cooling (VAC), which allows users to maximize thermal performance while simultaneously minimizing fan noise. It also is tested to TDP levels over 175 W.

“At the heart of every computer is a CPU whose performance is dictated by the chip design, the clock speed and processor cache. As users push the limits of their high-performance systems, they create thermal loads that require a reliable CPU cooling solution to deliver the necessary performance. With the innovative use of our proprietary SilverCore solid-state technology, we’re disrupting the high-performance CPU cooling market by offering a solution that will not only meet performance needs but provide an option for safer, smaller, more durable processor cooling,” Michael Bruno, vice president at Phononic, added.

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New Adhesives Ideal for Bonding and Encapsulating Semiconductors

DELO introduces new one-component epoxy resins that can withstand temperatures up to 250 degrees Celsius. These new anhydride-based adhesives are ideal for bonding and encapsulating sensors and semiconductors, according to the company.

The adhesives were designed for high-reliability applications in automotive, consumer, and industrial electronics. They are ideal for use in oil drilling and power electronics.

The adhesives offer a wide temperature range of -65 to +250 degrees Celsius, high temperature resistance, high chemical resistance, high stability and strength, a low thermal expansion of 11 ppm/K, compression shear strength on ceramic of 8 MPa at 220 degrees Celsius and a tensile strength of 50 MPa after 500 hours of storage at 250 degrees Celsius.

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TIM with EMI Absorption Capabilities Announced

Henkel introduces the first ever low-stress thermal interface material with EMI absorption capabilities, known as the Gap Pad EMI 1.0.

“The latest in its line of BERGQUIST GAP PAD products, Henkel’s GAP PAD EMI 1.0 offers electronic specialists critical heat and electromagnetic energy control in a flexible, gap filling product designed to exhibit exceptionally low stress,” the company said.

“Today’s electronics devices are smaller and higher-functioning than ever before. In addition, widely recognized industry standards defined to control applications that use multiple frequencies dictate effective EMI and heat transfer management for end product acceptance and reliability.  These facts were the driving force behind the development of GAP PAD EMI 1.0,” Doug Dixon, Henkel’s global marketing director, said.

The gap pad is ideal for use in consumer, electronics, telecommunications, LEDs and automotive applications.

“Not only does GAP PAD EMI 1.0 technology offer superb thermal and EMI performance, but the material is the softest and most compliant on the market.  Its ability to conform to various topographies and provide a high degree of flexibility ensures exceptionally low stress on solder joints,” the company reported. The GAP PAD EMI 1.0 reduces joint stress and fractures that lead to in-field failures.

The TIM also offers a thermal conductivity of 1.0 W/m-K, EMI absorption for frequencies above 1GHz, robust thermal management control, high levels of EMI protection, and more. It is also available in various sizes and thicknesses as well as in both die-cut of sheet forms. The adhesive can also be reworked easily.

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ITherm 2016 – Call for Papers!

Call for papers for the IEEE/CPMT ITherm Conference for 2016! Abstracts are due September 4, 2015.

ITherm 2016 is the leading international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages, and systems. The conference will take place from May 31 – June 3, 2016 in Las Vegas, Nevada.

For more information click here.

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DesignCon 2016

DesignCon 2016
Jan 19- 21, 2016
Santa Clara, CA

DesignCon is the premier conference for chip, board and systems design engineers in the high speed communications and semiconductor communities. It was created by engineers for engineers and remains the largest gathering of chip, board and systems designers in the country. Combining technical paper sessions, tutorials, industry panels, product demos and exhibits, DesignCon brings engineers the latest theories, methodologies, techniques, applications and demonstrations on PCB design tools, power and signal integrity, jitter and crosstalk, high-speed serial design, test and measurement tools, parallel and memory interface design, ICs, semiconductor components and more.

More Information Here. 

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Hong Kong International Lighting Fair

Hong Kong International Lighting Fair
October 27 – 30, 2015
Hong Kong, China

Organized by the HKTDC and held at the HKCEC, the Hong Kong International Lighting Fair (Autumn Edition) is the largest autumn lighting fair in Asia. Exhibits include advertising lighting, commercial lighting, household lighting, LED & green lighting, lighting accessories, parts & components, outdoor lighting, smart lighting & solutions, testing, certification & inspection, along with Hall of Aurora for branded lighting.

More Information Here.

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