Electric & Hybrid Vehicle Technology Expo

 

Electric & Hybrid Vehicle Technology Expo
September 15-17, 2015
Novi, Michigan, USA

Electric & Hybrid Vehicle Technology Expo is the premier showcase for electric and hybrid vehicle technology and innovation. The show highlight advances right across the powertrain and across a wide range of vehicles from passenger and commercial to off-highway industrial vehicles.

More Information Here.

Original Source http://ift.tt/1PhqCnK

Advertisements

SEMICON Taiwan 2015

SEMICON Taiwan 2015

September 2-4, 2015

Taipei, Taiwan

SEMICON Taiwan is the premier event in Taiwan for microelectronics manufacturing. Connect with the companies, people, products and information shaping the future of design and manufacturing for semiconductors, nanoelectronics, MEMS, Photovoltaics and related advanced electronics. Experience everything that SEMICON Taiwan has to offer.

More Information Here.

 

Original Source http://ift.tt/1IYv1Zh

Liquid Cooling – Practical Guidelines to Design & Manufacture

Thermal Live 2015 is a brand new, FREE, 3-day online event focused on Thermal Management Techniques and topics. The event features webinars, roundtables, whitepapers, videos and more. There is no cost to attend.

Registration is Now Open for the Free Webinar, “Liquid Cooling – Practical Guidelines to Design & Manufacture,” presented by Wakefield-Vette.

Webinar Overview: Industry trends continue to produce smaller footprints with higher power densities. In some cases, Liquid Cooling is the answer for cooling your application. This discussion will go over the basic design and structure of several standard and custom liquid cooling solutions while highlighting the manufacturing process most appropriate for your application.

Learn more about Thermal Live 2015 and register now.

Original Source http://ift.tt/1L9e8xH

Liquid-cooled Primergy Server to Cut Energy Costs in Half

Fujitsu unveiled a new liquid-cooled Primergy server, the Primergy CX400 M1, which will cut energy costs in half and increase density in data centers by five times.

“Fujitsu is revolutionizing data center design, and is the first major vendor to deliver direct-to-chip liquid cooling for more efficient building and operation of scale-out data centers,” Uwe Romppel, head of product management server at Fujitsu, said.

“The technology will enable users to hit a power usage effectiveness (PUE) as low as 1.06 and offers them a way of recycling the heat waste so it can be used somewhere else. PUE measures energy efficiency, with a 1.0 being the optimal score,” Romppel added.

The company also introduced new cluster nodes – the CX2550 M1 and CX2570 M1. The cluster nodes use up to 160 Xeon chips from Intel and 1,280 memory modules per standard rack, according to the company.

Original Source http://ift.tt/1h3r0fa

New TIMs for ECUs and Embedded Systems Cooling

Fujipoly America Corporation introduces an assortment of TIMs for commercial and military vehicle ECUs and embedded systems cooling.

“The company manufactures its proprietary Sarcon® material in many different forms, thicknesses and shapes to satisfy nearly any application requirement.  These silicone based options include sheets, thin films, putty, and form-in-place compounds,” according to the company.

The new TIMs offer high performance, a low manufacturing cost, a thermal conductivity range from 0.9 to 17.0 W/m°K and a thermal resistance of .02°Cin2/W at 14.5 PSI.

Original Source http://ift.tt/1h3qZIj

Partnership Forms to Offer New Liquid-cooling Solutions

Mellanox Technologies and Icetope are partnering to offer liquid-cooled InfiniBand and Ethernet network interconnects for high-performance computing.

The companies are combining Icetope’s liquid-cooling technology and Mellanox’s knowledge of high performance networks to produce a “36-port FDR (fourteen data rate) 56Gb/s InfiniBand and 40/56Gb Ethernet switches that can be housed in Iceotope’s PetaGen cabinet.”

“Iceotope offers a liquid-cooling system that includes compute and networking blades that are each sealed and self-contained systems that are immersed in what officials call the primary coolant—a “sophisticated, non-conducive, engineered fluid.” The liquid rapidly moves the heat away from the blades to a second coolant in the cabinet,” according to eWeek.

The coolant in the cabinet offers double the heat capacity of mineral oil as well as half the viscosity. The coolant is circulated through energy-efficient pumps and captures heat coming out of the system. This heat can be reused for other purposes, like to heat buildings.

“These liquid-cooled switches represent a huge step towards entirely fan-less HPC [high-performance computing]. The HPC industry is embracing liquid cooling at a remarkable rate. It’s just a case of technologies being available to match demand. Until now, it was widely accepted that the interconnect switch would never be liquid cooled. It’s great to be able to say that, thanks to our work with Mellanox, that’s no longer the case,” Peter Hopton, Iceotope founder, said.

Original Source http://ift.tt/1Wj8QG4

Three New Lines of TIMs Offer High Thermal Conductivity

Aavid Thermalloy introduces three new lines of high-performance thermal interface materials – thermally conductive gap fillers. The three lines include the SuperThermal™, SoftFlex™, and WaveBlocker™. These product lines offer very high thermal conductivity without compromising workability or compliancy.

“The new lines of thermal gap fillers are designed to increase the performance and capabilities of electronics’ design. Each is specially formulated to support specific application requirements that, when combined with their high thermal conductivities, will significantly improve functionality,” according to the company.

The SuperThermal™ line offers high thermal conductivity up to 13.2 watts per meter Kelvin.

“The average thermal conductivity for SuperThermal™ gap fillers is such that utilizing these pads allows engineers to use smaller thermal solutions or considerably increase performance without increasing the volume or weight of the solution or device,” Aavid Thermalloy added.

The SoftFlex™ line is manufactured with five different materials that vary in conductivity, compliancy, cushioning ability and elasticity. Because of its softness and compressibility, the SoftFlex line is the best option for use in applications with increased shock or vibration and to decrease board strain. It was designed for applications with multiple device heights and to offer more design flexibility.

The WaveBlocker™ line offers gap fillers with high electromagnetic permeability, which dampens electromagnetic interference (EMI). These gap fillers offer high signal accuracy and are best suited for use in audio equipment, radios and testing equipment. This line is ideal for use in Aerospace and Military applications.

Original Source http://ift.tt/1P6XfEQ