SANYO DENKI Develops 92 x 92 x 38 mm Splash Proof Fan

Industry-leading airflow, static pressure, and service life SANYO DENKI has developed and launched the San Ace 92W 9WL type 92 x 92 x 38 mm Splash Proof Fan. This fan features the longest service life as well as the highest […]

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Cool Your Electronic Devices at the Component Level

Sponsored by International Manufacturing Services, Inc. (IMS) The IMS Aluminum Nitride (AlN) ThermaBridge™ is a simple, cost effective device which aids in thermal management. The ThermaBridge™ is designed to transport heat from one location to another through an electrically isolated, thermally […]

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Electrolube Address Major Market Changes to the Thermal Management of LEDs

Ahead of emerging changes within the LED market, global electro-chemicals manufacturer, Electrolube, has addressed growing concerns affecting LED manufacturers regarding the thermal management of LEDs. The changes that will impact on the LED market are being driven by 2 major […]

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Increasing Adoption of Cryocoolers in the Semiconductor Industry driving the growth of Cryocoolers Market

The report “Cryocooler Market by Type (GM, PT, JT, Stirling, and Brayton Cryocoolers), Services (Technical Support, Repair, Preventive Maintenance), Heat Exchanger Type (Recuperative and Regenerative), Application, and Geography – Global Forecast to 2022″. The global cryocooler market is projected to […]

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Integrated Nano-enhanced Thermal Management Techniques May Boost Photovoltaic Efficiencies

With solar energy systems growing in popularity and adoption across the globe, methods for enhancing the efficiency and power density of solar cells are a hot topic for renewable energy research labs. Essentially all photovoltaic technologies currently available suffer from […]

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Thermal Management of Outdoor Enclosures, Part 1

The pace of development in the electronics and telecommunication fields has been accelerating in all aspects of the business. For example, electronics/telecommunications equipment has traditionally been housed in large buildings, smaller buildings (sheds) and outdoor cabinets. The introduction of the […]

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The Junction-to-Case Thermal Resistance: A One-Dimensional Underachiever in a Three-dimensional, Conjugate Heat Transfer World

INTRODUCTION As integrated circuits were becoming more widespread in the 1980’s, most of the developmental problems had to do the with electrical operation of the devices and not so much on cooling them, due to low power levels. It was […]

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