High-Performance Circuit Materials Exhibited at Upcoming Conference

Rogers Corporation will exhibit its high-performance circuit materials at the PCB West 2016 Conference and Exhibition, booth 201.

Designed to dissipate heat in high-power applications, thermally enhanced 92ML laminates and prepregs are halogen-free, flame-retardant, thermally conductive epoxy-based thermoset materials that provide a lead-free-solder-compatible solution for effectively dissipating heat in multilayer circuit designs.

92ML materials have a glass transition temperature (Tg) of +160C and high thermal conductivity of 2.0 W/m•K, and so can be supplied with copper cladding to 4 oz. thickness. When even greater cooling capability is needed, 92ML StaCool™ laminates are available with an insulated metal substrate (IMS). The IMS heatsink can be machined to custom requirements, serving as part of the mechanical design in the final application.

In addition, they will also be supporting a technical symposium for printed-circuit-board (PCB) users and designers with a presentation on the effects of conductor metal surface roughness on high-frequency PCB performance at the conference.

 

Original Source http://ift.tt/2c3v4cC

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