Temporary Bonding Adhesive for Thin Wafer Handling Introduced

AI Technology has developed specialized tools and equipment to handle thin wafers and thin reconstituted wafers.

A series of temporary bonding materials can process temperatures up to 150 Cº, and are well accepted for grinding, dicing, etching, and deposition.

AIT’s high temperature wafer processing adhesives (WPA) handle higher temperature processing, and can withstand processing temperature up to 330ºC.

Besides supplying these WPA products in spin coating liquid, AIT also provides WPA as a thin film.

warp wafer processing

Original Source http://ift.tt/2aYwgiA


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Karis World

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