(May 18, 2016) As the heat produced by electronic components continues to increase, suggestions are made to push for improvement on better managing industrial enclosure temperatures.
“Relative to each individual component, the heat of electronic components has increased significantly in recent years,” reported ECNMag.com, “At the same time, the density inside control cabinets has increased dramatically, resulting in a 50 – 60% increase in heat in the enclosures. If heat is not managed properly and the maximum permitted operating temperature is exceeded, the service life of these components is halved and the failure rate is doubled.”
“Smarter, intuitive, and more efficient designs will need to be a staple no matter what setting the enclosure is in,” said ECN Mag, “Designers will need to take careful consideration in the initial planning stages of projects, ensuring that the appropriate cooling technology is incorporated into designs.”
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