Guarantee Reliability with Thermal Cycling Webinar

Guarantee Reliability with Thermal Cycling Webinar
Online (Webinar series)
January 28, 2016 – 11am and 2pm

This webinar provides an overview of thermal cycling induced failures in printed circuit board assemblies. The two main failure modes that are explored are solder joint and plated through hole fatigue. A close examination of the effect of board properties will also be provided. We will discuss the usage of analytical and semi-analytical prediction methodologies.

For more information and to register, click here.

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Karis World

Hey, I'm a health nut who spends a lot of my time finding out about the latest and oldest ways to be healthy. I share on my blog all kinds of stuff about women's health, skin care, holistic healing, aging, and all sorts of other stuff.

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