Guarantee Reliability with Thermal Cycling Webinar
Online (Webinar series)
January 28, 2016 – 11am and 2pm
This webinar provides an overview of thermal cycling induced failures in printed circuit board assemblies. The two main failure modes that are explored are solder joint and plated through hole fatigue. A close examination of the effect of board properties will also be provided. We will discuss the usage of analytical and semi-analytical prediction methodologies.
For more information and to register, click here.
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