Iceotope is using innovative liquid cooling technology for the European project ExaNeSt as reported by Inside HPC.
The ExaNeSt project objective is to develop a prototype exascale supercomputer in three years.
Peter Hopton from Iceotope explained that in their role in the exascale supercomputing race they “get different devices at very high density that want to be very closely packed together,” so they need to be cooled.
Iceotope’s liquid cooling method, according to Hopton, begins with immersing the electronics in a liquid fluorinated plastic, “a plastic that is liquid at room temperature and [is] inert,” then this “very naturally connective” coolant “moves around very quickly as heat is supplied to it.”
“It’s contained within our blades and when you apply heat from the electronics, it rises, and then it dumps that heat to the shell of the blade where it goes into the cabinet level cooling back plain, using water,” says Hopton, “That enables us to have hot water input.”
Hopton adds that in order to achieve the exascale goal, they will need to “go double –sided, double-density in terms of the cooling in order to move to a system that’s dense enough.”
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