New High-Rise Nano-Materials Incorporate Thermal Cooling Layers

Researchers and Stanford engineers are creating a new approach to the layout of computer processors and memory chips (called Nano-Engineered Computing Systems Technology, or N3XT) where processors and memory are stacked on top of one another like a high-rise architecture.

This could cause immediate problems involving heat, but Stanford mechanical engineers Kenneth Goodson and Mehdi Asheghi have a solution.

“Just as skyscrapers have ventilation systems, N3XT high-rise chip designs incorporate thermal cooling layers,” reports Phys.org, “This work, […] ensures that the heat rising from the stacked layers of electronics does not degrade overall system performance.”

A working prototype has been demonstrated as “a thousand times more efficient in carrying out many important and highly demanding industrial software applications,” according to Phys.org.

To learn more, click here.

Original Source http://ift.tt/1QGRFvQ

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Karis World

Hey, I'm a health nut who spends a lot of my time finding out about the latest and oldest ways to be healthy. I share on my blog all kinds of stuff about women's health, skin care, holistic healing, aging, and all sorts of other stuff.

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