Heat-pipes May be a Solution for Heat Dissipation in New Smartphone

According to Chinese site UDN, Samsung is looking for a heat-pipe supplier to dissipate heat from the Galaxy S7 smartphone’s processor.

“Tiny pipes inside the phone are filled with a liquid coolant, which circulates around the heat-producing components like the chipset and then away, taking excess heat with it,” Slash Gear reported.

Because space is limited in smartphones, Samsung is reportedly looking for a 0.6 mm thick solution or smaller.

“Chip heat has been a contentious topic in recent years, as smartphone manufacturers chase greater performance and users become more demanding of their devices,” Slash Gear added.

Original Source http://ift.tt/1NfLFFS


Published by

Karis World

Hey, I'm a health nut who spends a lot of my time finding out about the latest and oldest ways to be healthy. I share on my blog all kinds of stuff about women's health, skin care, holistic healing, aging, and all sorts of other stuff.

Leave a Reply

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out /  Change )

Google+ photo

You are commenting using your Google+ account. Log Out /  Change )

Twitter picture

You are commenting using your Twitter account. Log Out /  Change )

Facebook photo

You are commenting using your Facebook account. Log Out /  Change )


Connecting to %s