Investigating New Methods for Removing Heat from 3-D Integrated Circuitry

Franklin Robinson, a NASA Thermal Engineer, and his team are studying different cooling techniques so that NASA might benefit from future integrated circuitry.

“To make sure NASA benefits from this emerging 3-D-circuit technology, Robinson and his team have begun investigating a technology that would remove heat by flowing a coolant through embedded channels about the size of a human hair within or between the chips,” according to

Robinson’s team is also exploring the effectiveness of “flow boiling,” where the coolant boils as it flows through the tiny gaps.

“Under his research, Robinson is evaluating two-phase flows in miniature channels, with the goal of producing a list of criteria for channel dimensions, flow parameters and fluid properties that produce gravity insensitivity.” reported.

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