Investigating New Methods for Removing Heat from 3-D Integrated Circuitry

Franklin Robinson, a NASA Thermal Engineer, and his team are studying different cooling techniques so that NASA might benefit from future integrated circuitry.

“To make sure NASA benefits from this emerging 3-D-circuit technology, Robinson and his team have begun investigating a technology that would remove heat by flowing a coolant through embedded channels about the size of a human hair within or between the chips,” according to Phys.org.

Robinson’s team is also exploring the effectiveness of “flow boiling,” where the coolant boils as it flows through the tiny gaps.

“Under his research, Robinson is evaluating two-phase flows in miniature channels, with the goal of producing a list of criteria for channel dimensions, flow parameters and fluid properties that produce gravity insensitivity.” Phys.org reported.

Original Source http://ift.tt/1M7oa18

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Karis World

Hey, I'm a health nut who spends a lot of my time finding out about the latest and oldest ways to be healthy. I share on my blog all kinds of stuff about women's health, skin care, holistic healing, aging, and all sorts of other stuff.

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