Yesterday, during the 2015 IEEE ECCE conference and exposition in Montréal, Canada, Mersen presented the R-Tools GEN III. Mersen will show the redesigned interactive 3D Thermal Heatsink Modeling simulation software today, Sept. 22, as well.
“R-Tools Gen III is a free on-line simulation software that allows users to model the optimum air cooled heatsink solution tailored to their project requirements,” according the company.
In addition to the R-Tools GEN III, Mersen will be sharing their Integrated Architecture approach, which is “leveraging latest power electronics product innovations in the field of cooling technologies, laminated bus bar designs and semiconductor fuses for electrical power protection,” added Mersen.
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