Henkel introduces the first ever low-stress thermal interface material with EMI absorption capabilities, known as the Gap Pad EMI 1.0.
“The latest in its line of BERGQUIST GAP PAD products, Henkel’s GAP PAD EMI 1.0 offers electronic specialists critical heat and electromagnetic energy control in a flexible, gap filling product designed to exhibit exceptionally low stress,” the company said.
“Today’s electronics devices are smaller and higher-functioning than ever before. In addition, widely recognized industry standards defined to control applications that use multiple frequencies dictate effective EMI and heat transfer management for end product acceptance and reliability. These facts were the driving force behind the development of GAP PAD EMI 1.0,” Doug Dixon, Henkel’s global marketing director, said.
The gap pad is ideal for use in consumer, electronics, telecommunications, LEDs and automotive applications.
“Not only does GAP PAD EMI 1.0 technology offer superb thermal and EMI performance, but the material is the softest and most compliant on the market. Its ability to conform to various topographies and provide a high degree of flexibility ensures exceptionally low stress on solder joints,” the company reported. The GAP PAD EMI 1.0 reduces joint stress and fractures that lead to in-field failures.
The TIM also offers a thermal conductivity of 1.0 W/m-K, EMI absorption for frequencies above 1GHz, robust thermal management control, high levels of EMI protection, and more. It is also available in various sizes and thicknesses as well as in both die-cut of sheet forms. The adhesive can also be reworked easily.
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