TIM with EMI Absorption Capabilities Announced

Henkel introduces the first ever low-stress thermal interface material with EMI absorption capabilities, known as the Gap Pad EMI 1.0.

“The latest in its line of BERGQUIST GAP PAD products, Henkel’s GAP PAD EMI 1.0 offers electronic specialists critical heat and electromagnetic energy control in a flexible, gap filling product designed to exhibit exceptionally low stress,” the company said.

“Today’s electronics devices are smaller and higher-functioning than ever before. In addition, widely recognized industry standards defined to control applications that use multiple frequencies dictate effective EMI and heat transfer management for end product acceptance and reliability.  These facts were the driving force behind the development of GAP PAD EMI 1.0,” Doug Dixon, Henkel’s global marketing director, said.

The gap pad is ideal for use in consumer, electronics, telecommunications, LEDs and automotive applications.

“Not only does GAP PAD EMI 1.0 technology offer superb thermal and EMI performance, but the material is the softest and most compliant on the market.  Its ability to conform to various topographies and provide a high degree of flexibility ensures exceptionally low stress on solder joints,” the company reported. The GAP PAD EMI 1.0 reduces joint stress and fractures that lead to in-field failures.

The TIM also offers a thermal conductivity of 1.0 W/m-K, EMI absorption for frequencies above 1GHz, robust thermal management control, high levels of EMI protection, and more. It is also available in various sizes and thicknesses as well as in both die-cut of sheet forms. The adhesive can also be reworked easily.

Original Source http://ift.tt/1hD5ZIy


Published by

Karis World

Hey, I'm a health nut who spends a lot of my time finding out about the latest and oldest ways to be healthy. I share on my blog all kinds of stuff about women's health, skin care, holistic healing, aging, and all sorts of other stuff.

Leave a Reply

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out /  Change )

Google+ photo

You are commenting using your Google+ account. Log Out /  Change )

Twitter picture

You are commenting using your Twitter account. Log Out /  Change )

Facebook photo

You are commenting using your Facebook account. Log Out /  Change )


Connecting to %s