New Adhesives Ideal for Bonding and Encapsulating Semiconductors

DELO introduces new one-component epoxy resins that can withstand temperatures up to 250 degrees Celsius. These new anhydride-based adhesives are ideal for bonding and encapsulating sensors and semiconductors, according to the company.

The adhesives were designed for high-reliability applications in automotive, consumer, and industrial electronics. They are ideal for use in oil drilling and power electronics.

The adhesives offer a wide temperature range of -65 to +250 degrees Celsius, high temperature resistance, high chemical resistance, high stability and strength, a low thermal expansion of 11 ppm/K, compression shear strength on ceramic of 8 MPa at 220 degrees Celsius and a tensile strength of 50 MPa after 500 hours of storage at 250 degrees Celsius.

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